CAPABILITIES
Defining the PCB Connect Group PCB Capabilities
The information contained within our technology capabilities plan outlines the technologies that the PCB Connect Group offers as a standard today and our development activity for the future. This is not an exhaustive list of our technology & product types but is provided as an overview to demonstrate the kind of product we are manufacturing and the working tolerances we achieve.
Our capabilities are divided into two categories, “working” capabilities, which show the current extent of our capability & “developmental”, which shows the next phase of our technology development across our business.
For further information about the PCB Connect Group’s PCB capabilities, contact one of our technical experts in your local PCB Connect Business.
RIGID CAPABILITY
Multilayer PCB is a printed circuit board that has more than, at least, two layers, with one or multiple conductor patterns inside the board. The PCB Connect Group supports the full range of Multilayer PCB manufacturing. Utilizing our broad and experienced engineering capability, we have the experience and knowledge to help support your new Multilayer PCB design or advise on the most appropriate method of supply for your existing Multilayer products.
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Layers | 1 - 60L | 120L |
| Maximum Board Size (mm) | 1L, 2L, 1800 x 600mm | Multilayer 720 x 1200mm | 1L, 2L, 2000 x 600mm | Multilayer 600 x 1600mm |
| Board Thickness Range (No UL Limits) DS+ML (mm) | 0.15 to 10mm | 0.15 to 14mm |
| Board Thickness Min. UL DS+ML (mm) | DS: 0.08mm | ML: 0.15mm | DS: 0.08mm | ML: 0.15mm |
| Board Thickness Tolerance (mm) | ±0.1mm T<=1.0mm | ±10%T T>1.0mm | ±0.1mm T<=1.0mm | ±10%T T>1.0mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| FR4's Suppliers | UL Certified | Shengyi, KB, nanYa, GW, nouya, ITEQ, Panasonic, Isola, Rogers, TUC, Ventec, Uniplus, GDM, ILM | Shengyi, KB, nanYa, GW, ITEQ, Panasonic, Isola, Rogers, TUC, Ventec, Uniplus, GDM, ILM, Nelco, Meteorwave Rogers, CLTE, Genclad, RF35, FastRise27 |
| Metal base Suppliers | UL Certified | Polytronics, Shengyi, Ventec, Wazam, Boyu, Quanbao, Judeng, EMC, Chin-shi, Xingyuan | Polytronics, Shengyi, Ventec, Wazam, Boyu, Quanbao, Judeng, EMC, Chin-shi, Xingyuan |
| Ceramic Material Suppliers | UL Certified | Huaqing, Shengyi, Rogers, Arlon | Huaqing, Shengyi, Rogers, Arlon |
| PTFE Suppliers | UL Certified | Wangling, Zhongying, Rogers, Shengyi, Taconic, Arlon, Taixin | Wangling, Zhongying, Rogers, Shengyi, Taconic, Arlon, Taixin,Polyimide, Tk, LCP,BT,C-ply,Fradflex,Omega, ZBC2000 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Min. Line Width/Space (0.5oz) | Inner Layer | 2mil | 1.6mil |
| Min. Line Width/Space (1.0oz) | 3/3mil | 3/3mil |
| Min. Line Width/Space (2.0oz) | 5/5mil | 5/5mil |
| Min. Line Width/Space (3.0oz) | 6.5/6.5mil | 5.5/6.0mil |
| The Min. Distance Hole to Copper | 4L: 3mil；6-8L: 4mil；10-12L: 4mil；10-16L: 6mil；18-22L: 8mil；24-28L: 10mil；≥30L: 12mil | 4L: 3mil；6-8L: 4mil；10-12L: 4mil；10-16L: 6mil；18-22L: 8mil；24-28L: 10mil；≥30L: 12mil |
| The Min. Registration for Lamination | ±2mil | ±2mil |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Line Width/Space (0.5oz) UL Certified | Outer Layer | 3/3mil | 3/3mil |
| Impedance Tolerance | ±5Ω（＜50Ω) | ±10%（≥50Ω） | ±5Ω（＜50Ω) | ±10%（≥50Ω) |
| Line Width/Space (base 0.5oz） | 2.8/2.8mil | 2.2/2.2mil |
| Line Width/Space (base 1.0oz) | 3/3mil | 3/3mil |
| Line Width/Space (base 2.0oz) | 6/6mil | 6/6mil |
| Line Width/Space (base 3.0oz) | 8/8mil | 8/8mil |
| Max. Copper Thickness UL DS/ML | DS: 12oz | ML: 12oz | DS: 12oz | ML: 12oz |
| Min. Copper Thickness UL DS/ML | DS: 0.3oz | ML: 0.3oz | DS: 0.3oz | ML: 0.3oz |
| To keep solder mask bridge, the min. distance between pad to pad (0.5oz base) green solder mask | 6mil | 6mil |
| To keep solder mask bridge, the min. distance between pad to pad (0.5oz base) black solder mask | 6.5mil | 6.5mil |
| To keep solder mask bridge, the min. distance between pad to pad (1oz base) green solder mask | 6.5mil | 6.5mil |
| To keep solder mask bridge, the min. distance between pad to pad (1oz base) black solder mask | 7mil | 7mil |
| To keep solder mask bridge, the min. distance between pad to pad (2oz base) green solder mask | 7mil | 7mil |
| To keep solder mask bridge, the min. distance between pad to pad (2oz base) black solder mask | 8.5mil | 7.7mil |
| To keep solder mask bridge, the min. distance between pad to pad (3oz base) green solder mask | 9.5mil | 8.0mil |
| To keep solder mask bridge, the min. distance between pad to pad (3oz base) black solder mask | 10.5mil | 8.0mil |
| Max. Tenting Holes Capability with Dry Film | 10mm | 10mm |
| Covered Slot Capability for Dry Film | 4mm x 12mm | 4mm x 12mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Maximum Copper Weight Inner Layer | 0.3-13oz | 0.3-30oz |
| Copper Weight | UL Certified | 0.3-13oz | 0.3-13oz |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Maximum Copper Weight Outer Layer | 12oz | 15oz |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Drill Bits Range | 0.1 - 6.5mm | 0.1 - 6.5mm |
| Slot Tolerance | PTH slot ±0.075mm | NPTH slot ±0.05mm | PTH slot ±0.075mm | NPTH slot ±0.05mm |
| Minimum Slot Width | 0.2mm | 0.2mm |
| Multi Drilling, Min. Slot Relation Length - Width (1-1.1 is /t possible) | 1.2:1 | 1.2:1 |
| The Min. Distance Between Vias Wall in Different Net | The Same Net: 6mil | Different Net: 10mil | The Same Net: 6mil | Different Net: 10mil |
| Hole Wall Roughness Can Control (<) | 25um | 25um |
| The Min. Depth for Control Routing | 0.15mm | 0.15mm |
| The Depth Tolerance for Control Routing | ±0.05mm | ±0.05mm |
| Angle Like Counter Sink | 30° - 180° | 30° - 180° |
| The Min. Backdrill Hole | PTH 0.15mm | NPTH 0.25mm | PTH 0.15mm | NPTH 0.25mm |
| Backdrill Depth Tolerance | ±0.075mm | ±0.05mm |
| Backdrill Accuracy | ±0.05mm | ±0.05mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Aspect Ratio | 25:1 | 28:1 |
| PTH Hole Size Minimum Tolerance | ±2mil | ±2mil |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Colour for Soldermask | Green, Yellow, Black, Blue, Red, White, Matt Green, Matt Black, Purple, Orange, Transparent, Grey | Green, Yellow, Black, Blue, Red, White, Matt Green, Matt Black, Purple, Orange, Transparent, Grey |
| Suppliers for Soldermask | UL Certified | Taiyo, Kuangshun, ABQ, Rongda, Coants, nanya, Tamura, Onstatic, Advance, Yanmo, Greencure | Taiyo, Kuangshun, ABQ, Rongda, Coants, /nya, Tamura, Onstatic, Advance, Yanmo, Greencure |
| Solder Mask Process: Screen Printing, Spray Coating, Curtain Coating, Direct Printing | Screen Printing, Spray Coating, Inkjet, Curtain Coating | Screen Printing, Spray Coating, Inkjet, Curtain Coating, Direct Printing |
| Soldermask Thickness | 5-60um | 5-60um |
| Plumpness for Soldermask Plug | 90% | 90% |
| Plumpness for Resin Plug | 100% | 100% |
| The Min. Soldermask Dam | 2.8mil | 2.8mil |
| Minimum Open Hole Size with Soldermask Opening (No Soldermask Inside the Hole) | 0.10mm | 0.10mm |
| Maximum Hole Size for Covering Without Plugging | 0.65mm | 0.65mm |
| Maximum Hole Size for SM Plugging | 0.65mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Available Silkscreen Colour | White, Yellow, Black, Red, Green, Blue | White, Yellow, Black, Red, Green, Blue |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Available Surface Finishes | OSP, HASL-LF, HASL, ENIG, Immersion Tin, Immersion Silver, Gold Finger | OSP, HASL-LF, HASL, ENIG, Immersion Tin, Immersion Silver, Gold finger, Hard Gold Plating, Soft Gold Plating, Selective OSP, ENEPIG, Flash Gold, EPIG, ASIG |
OSP | HASL
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Working Panel | OSP | 622x1200mm | 622x1200mm |
| The Min. Working Panel | 30x30mm | 30x30mm |
| The Max. Board Thickness | 6mm | 6mm |
| The Min. Board Thickness | 0.2mm | 0.2mm |
| The Thickness for OSP | 0.2-0.6um | 0.2-0.6um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Working Panel | HASL | 622×728mm | 1060x580mm |
| The Max. Board Thickness | 7.0mm | 7.0mm |
| The Min. Board Thickness | 0.4mm | 0.4mm |
| Tin Thickness on Surface | 1-50um | 1-50um |
| Tin Thickness in Hole | 1-40um | 1-40um |
| PB Free HASL | Yes | Yes |
IMMERSION GOLD | IMMERSION TIN | IMMERSION AG | GOLD FINGER
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Working Panel | Immersion Gold | 700x1000mm | 700x1000mm |
| The Max. Board Thickness | 7mm | 7mm |
| The Min. Board Thickness | 0.2mm | 0.1mm |
| Au Thickness | 0.025-0.125um | 0.013um-0.15um |
| Ni Thickness | 2-12um | 2-12um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Working Panel | Immersion Tin | 610mmx1500mm | 610mmx1500mm |
| The Min. Working Panel | 50x50mm | 50x50mm |
| The Max. Board Thickness | 7mm | 7mm |
| The Min. Board Thickness | 0.2mm | 0.2mm |
| Tin Thickness | 0.2-1.5um | 0.2-1.5um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Working Panel | Immersion Ag | 610mmx1500mm | 610mmx1500mm |
| The Min. Working Panel | 50x50mm | 50x50mm |
| The Max. Board Thickness | 5.0mm | 5.0mm |
| The Min. Board Thickness | 0.2mm | 0.2mm |
| Ag Thickness | 0.1-0.75um | 0.1-0.75um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Au Thickness | Gold Finger | 1~100u" | 1~100u" |
| Ni Thickness | 2-10um | 2-10um |
| Chamfer Angle | 15°- 60° | 15°- 60° |
| Chamfer Length | 0.1-3.0mm | 0.1-3.0mm |
| Chamfer Length Tolerance | ±0.075mm | ±0.075mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Routing | Profile Tolerance | ±0.1mm | ±0.1mm |
| The Min. Router Bit | 0.6mm | 0.6mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Jump V-Score | Yes | Yes |
| The Min. Distance for Jump V-Score | 6mm | 6mm |
| The Max. Working Panel | 850x1500mm | 1180x1480mm |
| The Max. Board Thickness | 4.20mm | 4.20mm |
| The Tolerance for V-Score Remain Thickness | ±0.05mm | ±0.05mm |
| Angle | 20°- 90° | 20°- 90° |
| The Accuracy for the V-Score Both Sides | ±0.05mm | ±0.05mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Bow & Twist | Min. | 0.50% | 0.30% |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Capacitance Material (3M C-PLY, Sanjing, Other) | Sample | Sample |
| Single Etch or Double Etch | Single | Single |
| The Max. Layers for Capacitance | 10L | 10L |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Etch Method After Gold Plating | Yes | Yes |
| Tie Line for Inner Layer Method | Yes | Yes |
| Gold Plate all Around the Fingers | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Etch Method | Yes | Yes |
| Gold Plate all Around the Fingers | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Peelable Soldermask | SD2955 | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Carbon Print | Yes | Yes |
| The Resistance Value Control (ohms/square) | 8Ω-50Ω | Tamura, Acheson, Asahi, Sheng Tian Feng, Chuandao | 8Ω-50Ω | Tamura, Acheson, Asahi, Sheng Tian Feng, Chuandao |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| FR4 and Rogers | Hybrid Lamination | Yes | FR4+Ro4350B | FR4+Ro4730G (Yes UL) | Other Hybrid Structure: Yes (No UL) |
| FR4 and PTFE | Yes | Yes (No UL) |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Inner Layers (UL) | Heavy Copper | Yes | Yes |
| Outer layers (UL) | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| AL Base + Thermal Conductivity Range | Metal Base | Yes | Yes |
| Copper Base | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Copper Fill Via | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Resin Filling & Cap | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| ?+N+? (Max. Number you can Build) | Sequential Buildup | 6+N+6 | 6+N+6 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Accuracy | Blind Holes Mechanical | ±0.05mm | ±0.038mm |
| Aspect Ratio | 15:1 | 15:1 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Size Tolerance | Counter Sink | ±0.1mm | PTH: ±0.05mm | NPTH: ±0.025mm |
| Angle | 60°-180° | 60°-180° |
HDI CAPABILITY
The HDI - High-Density Interconnector PCBs, have a higher wiring density compared with standard PCBs. Building on our experience in manufacturing technology, the PCB Connect Group can support HDI PCB’s up to any layer interconnected technology.
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| HDI | Raw Material Type (UL) | S1141, S1000H, S1000-2M, S1150G, R-5775, 480HR, 370HR, RO4350B, TU-883, TU-993, NP175F, HTE-800 | S1141, S1000H, S1000-2M, S1150G, R-5775, 480HR, 370HR, RO4350B, TU-883, TU-993, NP175F, HTE-800 |
| HDI | Raw Material Prepreg Type (UL) | 106, 106H, 1080, 1080H, 2113, 2116 | 106, 106H, 1080, 1080H, 2113, 2116 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Board Thickness | 6mm | 6.5mm |
| The Min. Board Thickness | 0.2mm | 0.2mm |
| The Min. Board Thickness UL | 0.1mm | 0.1mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. | 60L | 120L |
| Sequential | Yes | Yes |
| Any Layer | Yes | Yes |
| Max. X+N+X | 6+N+6 | 6+N+6 |
| Stacked Vias, Staggered Vias | Yes | Yes |
| Coupon for Micro Section | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Min. Line Width/Space | 1.6mil | 1.6mil |
| The Min. Distance Hole to Copper | 4mil | 4mil |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Min. Line Width/Space | 2mil/2mil | 2mil/2mil |
| Min. Line Width/Space | UL Certified | 2.5mil/2.5mil | 2.5mil/2.5mil |
| The Min. Distance Hole to Copper | 4mil | 4mil |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Min. Laser Vias | 0.075mm | 0.075mm |
| The Max. Laser Vias | 0.2mm | 0.15mm |
| Aspect Ratio Depth: Diameter | 1:0.75 | 0.8:1 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| LDD | Yes | Yes |
| Large Window | Yes | Yes |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Max. Hole Diameter | 0.15mm | 0.15mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Min. Copper Foil (1/4oz,1/3oz,3/8oz) | UL Certified | 1/4oz,1/3oz,3/8oz | 1/4oz,1/3oz,3/8oz |
| Min. Copper Foil (1/4oz,1/3oz,3/8oz) | UL Certified | 1/3oz | 1/3oz |
FLEX CAPABILITY
Flexible printed circuit boards are boards that uses flexible based material in your applications. Providing Flexible PCB Technology to some of the most demanding market segments globally, the need for reliability and maximum process control are key to success. With many years experience in the supply of Flexible PCB’s this product is one close collaboration through all aspects of the design phase truly pays dividends.
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. | 8L | 14L |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Stackup | UL Certified (In case of more, please provide) | 1L, 2L, 4L, 6L, 8L | 1L, 2L, 4L, 6L, 8L | FCCL(Shengyi) +Coverlay (Shengyi) | FCCL (Thinflex) +Coverlay (Xingao) |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Max. PCB Size for Shipping | 750x500mm | 2000x500mm |
| Min. PCB Size for Shipping | 2x2mm | 2x2mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. Board Thickness | UL Certified | 0.8mm | 0.8mm |
| The Min. Board Thickness | UL Certified | 0.06mm | 0.04mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Double Side | +/-0.025mm | +/-0.025mm |
| Multilayer | ±0.05mm | ±0.05mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Material PCB Supplier | UL Approved | Taiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, PI | Taiflex, Shengyi, ITEQ, Thinflex, Panasonic, Dupont, PI, Xingao, Fubang |
| Material PCB Supplier | UL Not Approved | Allstar, Jujiang | Allstar, Jujiang |
| Type Material with Adhesive | Taiflex, Shengyi, Thinflex | Taiflex, Shengyi, Thinflex, Fubang |
| Type Material Without Adhesive | Taiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, Lianmao, Taihong | Taiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, Lianmao, Taihong, Xingao |
| Thickness | UL Certified | 0.0125 - 0.075mm | 0.0125 - 0.16mm |
| Non-Flow Prepreg | Taiflex, Shengyi, Huashuo, S1000HB, S1000-2MB, Advance, Sony, Dongyi, Ventec | Taiflex, Shengyi, Huashuo, S1000HB, S1000-2MB, Advance, Sony, Dongyi, Ventec |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Min. Hole Size | 0.1mm | 0.1mm |
| Max. Hole Size | 6.4mm | 6.4mm |
| Hole Size Tolerance | ±0.05mm | ±0.05mm |
| Max. Aspect Ratio | 12:1 | 12:1 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| 1/3oz Or 1/4oz Capable + UL Certified | 1/3oz | 1/3oz |
| Max. Base Copper Capable + UL Certified | 2oz | 2oz |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Profile Tolerance | ±0.075mm | ±0.075mm |
| Routed Method (Laser, Punch) | CNC, Punch, Laser, Precision Die | CNC, Punch, Laser, Precision Die |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| 0.5oz Base Copper for Double Sides & Multilayer | UL Certified | Line Width/Spacing | 2/2mil | 1.6/1.6mil |
| 0.5oz Base Copper for Single Side | UL Certified | 2/2mil | 2/2mil |
| 1.0oz Base Copper for Double Sides & Multilayer | UL Certified | 3/3mil | 3/3mil |
| 1.0oz Base Copper for Single Side | UL Certified | 3/3mil | 3/3mil |
| 1/3oz, 1/4oz Base Copper | UL Certified | 43um/43um | 43um/43um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Min. Thickness | Coverlay | 12.5um | 12.5um |
| Max. Thickness | 75um | 85um |
| Min. Open Window | 0.1mm | 0.1mm |
| Cover Layer Type | 0515/0520/0525/1025/1035/1050 | 0515/0520/0525/1025/1035/1050 |
| The Tolerance for Coverlay Registration | ±0.5mil | ±0.1mil |
| The Registration for Coverlay | ±2mil | ±2mil |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Etch Tolerance | ±10% | ±10% |
| The Pattern Accuracy | 27.5um | 27.5um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Colour | Soldermask | UL Certified | Black, Blue, Yellow, Green, White | Black, Blue, Yellow, Green, White |
| The Registration for Soldermask | ±0.05mm | ±0.05mm |
| Min. Thickness | 5um | 5um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| OSP Thickness | Surface Finish | 0.1-0.5um | 0.1-0.5um |
| Gold Plate | IPC Standard | Yes | Yes | Au:0.05-1.25um |
| ENIG | IPC Standard | Yes | Yes | Au:0.05-0.175um |
| Immersion Tin | IPC Standard | Yes | Yes | 1-40um |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Impedance Tolerance | ±10% | ±10% |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Material (PI, FR4, Others) | PI, FR4, SUS, PET | PI, FR4, SUS, PET, ALU |
| Registration Tolerance | ±0.1mm | ±0.1mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Shielding Film Type | Protect Film | Yes | Yes | Fangbang HSF+SF5900 |
| Ag Pastes Type | Yes | Yes | JG-2680J |
FLEX-RIGID CAPABILITY
Flex-Rigid printed circuit boards are boards that uses a combination of rigid and flexible boards technologies in your applications. Incorporating our advanced technology and reliability, the PCB Connect Group Flex Rigid capability gives you the security that your product deserves. Using our collaborative design for cost and design for manufacture programs, we can optimize your Flex Rigid design to help achieve your product aims.
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| The Max. | 36L | 36L |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Max. PCB Size | 500x610mm | 500x800mm |
| Min. PCB Size | 2.5x2.5mm | 2.5x2.5mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Max. Board Thickness | 6.0mm | 6.0mm |
| Min. Board Thickness | UL Certified | 0.1mm | 0.1mm |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Most Core | 6 | 6 |
| CAPABILITY ELEMENT | STANDARD CAPABILITY | ADVANCED CAPABILITY |
|---|---|---|
| Symmetry | Yes | Yes |
| Non-Symmetry | Yes | Yes |
| Tail Fly | Yes | Yes |
| Air Gap | Yes | Yes |
| Others | Yes | Yes |