CAPABILITIES

Defining the PCB Connect Group PCB Capabilities

The information contained within our technology capabilities plan outlines the technologies that the PCB Connect Group offers as a standard today and our development activity for the future. This is not an exhaustive list of our technology & product types but is provided as an overview to demonstrate the kind of product we are manufacturing and the working tolerances we achieve.

Our capabilities are divided into two categories, “working” capabilities, which show the current extent of our capability & “developmental”, which shows the next phase of our technology development across our business.

For further information about the PCB Connect Group’s PCB capabilities, contact one of our technical experts in your local PCB Connect Business.

PCB Capabilities

RIGID CAPABILITY

Multilayer PCB is a printed circuit board that has more than, at least, two layers, with one or multiple conductor patterns inside the board. The PCB Connect Group supports the full range of Multilayer PCB manufacturing. Utilizing our broad and experienced engineering capability, we have the experience and knowledge to help support your new Multilayer PCB design or advise on the most appropriate method of supply for your existing Multilayer products.

CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Layers1 - 60L120L
Maximum Board Size (mm)1L, 2L, 1800 x 600mm | Multilayer 720 x 1200mm1L, 2L, 2000 x 600mm | Multilayer 600 x 1600mm
Board Thickness Range (No UL Limits) DS+ML (mm)0.15 to 10mm0.15 to 14mm
Board Thickness Min. UL DS+ML (mm)DS: 0.08mm | ML: 0.15mmDS: 0.08mm | ML: 0.15mm
Board Thickness Tolerance (mm)±0.1mm T<=1.0mm | ±10%T T>1.0mm±0.1mm T<=1.0mm | ±10%T T>1.0mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
FR4's Suppliers | UL CertifiedShengyi, KB, nanYa, GW, nouya, ITEQ, Panasonic, Isola, Rogers, TUC, Ventec, Uniplus, GDM, ILMShengyi, KB, nanYa, GW, ITEQ, Panasonic, Isola, Rogers, TUC, Ventec, Uniplus, GDM, ILM, Nelco, Meteorwave Rogers, CLTE, Genclad, RF35, FastRise27
Metal base Suppliers | UL CertifiedPolytronics, Shengyi, Ventec, Wazam, Boyu, Quanbao, Judeng, EMC, Chin-shi, XingyuanPolytronics, Shengyi, Ventec, Wazam, Boyu, Quanbao, Judeng, EMC, Chin-shi, Xingyuan
Ceramic Material Suppliers | UL CertifiedHuaqing, Shengyi, Rogers, ArlonHuaqing, Shengyi, Rogers, Arlon
PTFE Suppliers | UL CertifiedWangling, Zhongying, Rogers, Shengyi, Taconic, Arlon, TaixinWangling, Zhongying, Rogers, Shengyi, Taconic, Arlon, Taixin,Polyimide, Tk, LCP,BT,C-ply,Fradflex,Omega, ZBC2000
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Min. Line Width/Space (0.5oz) | Inner Layer0.05/0.05mm0.05/0.05mm
Min. Line Width/Space (1.0oz)0.076/0.076mm0.076/0.076mm
Min. Line Width/Space (2.0oz)0.127/0.127mm0.127/0.127mm
Min. Line Width/Space (3.0oz)0.165/0.165mm0.139/0.152mm
The Min. Distance Hole to Copper4L: 0.076mm; 6-8L: 0.1mm; 10-12L: 0.1mm; 10-16L: 0.15mm; 18-22L: 0.2mm; 24-28L: 0.254mm; ≥30L: 0.3mm4L: 0.076mm; 6-8L: 0.1mm; 10-12L: 0.1mm; 10-16L: 0.15mm; 18-22L: 0.2mm; 24-28L: 0.254mm; ≥30L: 0.3mm
The Min. Registration for Lamination±0.05mm±0.05mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Line Width/Space (0.5oz) UL Certified | Outer Layer0.076/0.076mm0.076/0.076mm
Impedance Tolerance±5Ω(<50Ω) | ±10%(≥50Ω)±5Ω(<50Ω) | ±10%(≥50Ω)
Line Width/Space (base 0.5oz)0.0711/0.0711mm0.056/0.056mm
Line Width/Space (base 1.0oz)0.076/0.076mm0.076/0.076mm
Line Width/Space (base 2.0oz)0.15/0.15mm0.15/0.15mm
Line Width/Space (base 3.0oz)0.2/0.2mm0.2/0.2mm
Max. Copper Thickness UL DS/MLDS: 420um | ML: 420umDS: 420um | ML: 420um
Min. Copper Thickness UL DS/MLDS: 10.5um | ML: 10.5umDS: 10.5um | ML: 10.5um
To keep solder mask bridge, the min. distance between pad to pad (0.5oz base) green solder mask0.152mm0.152mm
To keep solder mask bridge, the min. distance between pad to pad (0.5oz base) black solder mask0.165mm0.165mm
To keep solder mask bridge, the min. distance between pad to pad (1oz base) green solder mask0.165mm0.165mm
To keep solder mask bridge, the min. distance between pad to pad (1oz base) black solder mask0.178mm0.178mm
To keep solder mask bridge, the min. distance between pad to pad (2oz base) green solder mask0.178mm0.178mm
To keep solder mask bridge, the min. distance between pad to pad (2oz base) black solder mask0.216mm0.196mm
To keep solder mask bridge, the min. distance between pad to pad (3oz base) green solder mask0.241mm0.2mm
To keep solder mask bridge, the min. distance between pad to pad (3oz base) black solder mask0.267mm0.2mm
Max. Tenting Holes Capability with Dry Film10mm10mm
Covered Slot Capability for Dry Film4mm x 12mm4mm x 12mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Copper Thickness | Inner Layer10.5-455um10.5-455um
Copper Thickness | UL Certified10.5-455um10.5-455um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Maximum Copper Thickness | Outer Layer420um525um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Drill Bits Range0.1 - 6.5mm0.1 - 6.5mm
Slot TolerancePTH slot ±0.075mm | NPTH slot ±0.05mmPTH slot ±0.075mm | NPTH slot ±0.05mm
Minimum Slot Width0.2mm0.2mm
Multi Drilling, Min. Slot Relation Length - Width (1-1.1 is /t possible)1.2:11.2:1
The Min. Distance Between Vias Wall in Different NetThe Same Net: 0.15mm | Different Net: 0.254mmThe Same Net: 0.15mm | Different Net: 0.254mm
Hole Wall Roughness Can Control (<)0.025mm0.025mm
The Min. Depth for Control Routed0.15mm0.15mm
The Depth Tolerance for Control Routed±0.05mm±0.05mm
Angle Like Counter Sink30° - 180°30° - 180°
The Min. Backdrill HolePTH 0.15mm | NPTH 0.25mmPTH 0.15mm | NPTH 0.25mm
Backdrill Depth Tolerance±0.075mm±0.05mm
Backdrill Accuracy±0.05mm±0.05mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Aspect Ratio25:128:1
PTH Hole Size Minimum Tolerance±0.05mm±0.05mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Colour for SoldermaskGreen, Yellow, Black, Blue, Red, White, Matt Green, Matt Black, Purple, Orange, Transparent, GreyGreen, Yellow, Black, Blue, Red, White, Matt Green, Matt Black, Purple, Orange, Transparent, Grey
Suppliers for Soldermask | UL CertifiedTaiyo, Kuangshun, ABQ, Rongda, Coants, nanya, Tamura, Onstatic, Advance, Yanmo, GreencureTaiyo, Kuangshun, ABQ, Rongda, Coants, /nya, Tamura, Onstatic, Advance, Yanmo, Greencure
Solder Mask Process: Screen Printing, Spray Coating, Curtain Coating, Direct PrintingScreen Printing, Spray Coating, Inkjet, Curtain CoatingScreen Printing, Spray Coating, Inkjet, Curtain Coating, Direct Printing
Soldermask Thickness5-60um5-60um
Plumpness for Soldermask Plug90%90%
Plumpness for Resin Plug100%100%
The Min. Soldermask Dam0.0711mm0.0711mm
Minimum Open Hole Size with Soldermask Opening (No Soldermask Inside the Hole)0.10mm0.10mm
Maximum Hole Size for Covering Without Plugging0.65mm0.65mm
Maximum Hole Size for SM Plugging0.65mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Available Silkscreen ColourWhite, Yellow, Black, Red, Green, BlueWhite, Yellow, Black, Red, Green, Blue
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Available Surface FinishesOSP, HASL-LF, HASL, ENIG, Immersion Tin, Immersion Silver, Gold FingerOSP, HASL-LF, HASL, ENIG, Immersion Tin, Immersion Silver, Gold finger, Hard Gold Plating, Soft Gold Plating, Selective OSP, ENEPIG, Flash Gold, EPIG, ASIG

OSP | HASL

CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Working Panel | OSP622x1200mm622x1200mm
The Min. Working Panel30x30mm30x30mm
The Max. Board Thickness6mm6mm
The Min. Board Thickness0.2mm0.2mm
The Thickness for OSP0.2-0.6um0.2-0.6um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Working Panel | HASL622×728mm1060x580mm
The Max. Board Thickness7.0mm7.0mm
The Min. Board Thickness0.4mm0.4mm
Tin Thickness on Surface1-50um1-50um
Tin Thickness in Hole1-40um1-40um
PB Free HASLYesYes

IMMERSION GOLD | IMMERSION TIN | IMMERSION AG | GOLD FINGER

CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Working Panel | Immersion Gold700x1000mm700x1000mm
The Max. Board Thickness7mm7mm
The Min. Board Thickness0.2mm0.1mm
Au Thickness0.025-0.125um0.013um-0.15um
Ni Thickness2-12um2-12um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Working Panel | Immersion Tin610mmx1500mm610mmx1500mm
The Min. Working Panel50x50mm50x50mm
The Max. Board Thickness7mm7mm
The Min. Board Thickness0.2mm0.2mm
Tin Thickness0.2-1.5um0.2-1.5um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Working Panel | Immersion Ag610mmx1500mm610mmx1500mm
The Min. Working Panel50x50mm50x50mm
The Max. Board Thickness5.0mm5.0mm
The Min. Board Thickness0.2mm0.2mm
Ag Thickness0.1-0.75um0.1-0.75um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Au Thickness | Gold Finger1~100u"1~100u"
Ni Thickness2-10um2-10um
Chamfer Angle15°- 60°15°- 60°
Chamfer Length0.1-3.0mm0.1-3.0mm
Chamfer Length Tolerance±0.075mm±0.075mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Routing | Profile Tolerance±0.1mm±0.1mm
The Min. Router Bit0.6mm0.6mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Jump V-ScoreYesYes
The Min. Distance for Jump V-Score6mm6mm
The Max. Working Panel850x1500mm1180x1480mm
The Max. Board Thickness4.20mm4.20mm
The Tolerance for V-Score Remain Thickness±0.05mm±0.05mm
Angle20°- 90°20°- 90°
The Accuracy for the V-Score Both Sides±0.05mm±0.05mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Bow & Twist | Min.0.50%0.30%
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Capacitance Material (3M C-PLY, Sanjing, Other)SampleSample
Single Etch or Double EtchSingleSingle
The Max. Layers for Capacitance10L10L
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Etch Method After Gold PlatingYesYes
Tie Line for Inner Layer MethodYesYes
Gold Plate all Around the FingersYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Etch MethodYesYes
Gold Plate all Around the FingersYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Peelable Soldermask | SD2955YesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Carbon PrintYesYes
The Resistance Value Control (ohms/square)8Ω-50Ω | Tamura, Acheson, Asahi, Sheng Tian Feng, Chuandao8Ω-50Ω | Tamura, Acheson, Asahi, Sheng Tian Feng, Chuandao
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
FR4 and Rogers | Hybrid LaminationYesFR4+Ro4350B | FR4+Ro4730G (Yes UL) | Other Hybrid Structure: Yes (No UL)
FR4 and PTFEYesYes (No UL)
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Inner Layers (UL) | Heavy CopperYesYes
Outer layers (UL)YesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
AL Base + Thermal Conductivity Range | Metal BaseYesYes
Copper BaseYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Copper Fill ViaYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Resin Filling & CapYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
?+N+? (Max. Number you can Build) | Sequential Buildup6+N+66+N+6
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Accuracy | Blind Holes Mechanical±0.05mm±0.038mm
Aspect Ratio15:115:1
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Size Tolerance | Counter Sink±0.1mmPTH: ±0.05mm | NPTH: ±0.025mm
Angle60°-180°60°-180°

HDI CAPABILITY

The HDI - High-Density Interconnector PCBs, have a higher wiring density compared with standard PCBs. Building on our experience in manufacturing technology, the PCB Connect Group can support HDI PCB’s up to any layer interconnected technology.

CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
HDI | Raw Material Type (UL)S1141, S1000H, S1000-2M, S1150G, R-5775, 480HR, 370HR, RO4350B, TU-883, TU-993, NP175F, HTE-800S1141, S1000H, S1000-2M, S1150G, R-5775, 480HR, 370HR, RO4350B, TU-883, TU-993, NP175F, HTE-800
HDI | Raw Material Prepreg Type (UL)106, 106H, 1080, 1080H, 2113, 2116106, 106H, 1080, 1080H, 2113, 2116
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Board Thickness6mm7.62mm
The Min. Board Thickness0.2mm0.2mm
The Min. Board Thickness UL0.1mm0.1mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max.60L120L
SequentialYesYes
Any LayerYesYes
Max. X+N+X6+N+66+N+6
Stacked Vias, Staggered ViasYesYes
Coupon for Micro SectionYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Min. Line Width/Space0.045/0.045mm0.045/0.045mm
The Min. Distance Hole to Copper0.1mm0.1mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Min. Line Width/Space0.045/0.045mm0.045/0.045mm
Min. Line Width/Space | UL Certified0.0635/0.0635mm0.0635/0.0635mm
The Min. Distance Hole to Copper0.1mm0.1mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Min. Laser Vias0.075mm0.075mm
The Max. Laser Vias0.2mm0.15mm
Aspect Ratio Depth: Diameter1:0.750.8:1
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
LDDYesYes
Large WindowYesYes
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Max. Hole Diameter0.15mm0.15mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Min. Copper Foil (1/4oz,1/3oz,3/8oz) | UL Certified8um,12um,13um8um,12um,13um
Min. Copper Foil (1/4oz,1/3oz,3/8oz) | UL Certified12um12um

FLEX CAPABILITY

Flexible printed circuit boards are boards that uses flexible based material in your applications. Providing Flexible PCB Technology to some of the most demanding market segments globally, the need for reliability and maximum process control are key to success. With many years experience in the supply of Flexible PCB’s this product is one close collaboration through all aspects of the design phase truly pays dividends.

CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max.8L14L
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Stackup | UL Certified (In case of more, please provide)1L, 2L, 4L, 6L, 8L1L, 2L, 4L, 6L, 8L | FCCL(Shengyi) +Coverlay (Shengyi) | FCCL (Thinflex) +Coverlay (Xingao)
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Max. PCB Size for Shipping750x500mm2000x500mm
Min. PCB Size for Shipping2x2mm2x2mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max. Board Thickness | UL Certified0.8mm0.8mm
The Min. Board Thickness | UL Certified0.06mm0.04mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Double Side+/-0.025mm+/-0.025mm
Multilayer±0.05mm±0.05mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Material PCB Supplier | UL ApprovedTaiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, PITaiflex, Shengyi, ITEQ, Thinflex, Panasonic, Dupont, PI, Xingao, Fubang
Material PCB Supplier | UL Not ApprovedAllstar, JujiangAllstar, Jujiang
Type Material with AdhesiveTaiflex, Shengyi, ThinflexTaiflex, Shengyi, Thinflex, Fubang
Type Material Without AdhesiveTaiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, Lianmao, TaihongTaiflex, Shengyi, ITEQ, Thinflex, Panasonic, SY, Dupont, Lianmao, Taihong, Xingao
Thickness | UL Certified0.0125 - 0.075mm0.0125 - 0.16mm
Non-Flow PrepregTaiflex, Shengyi, Huashuo, S1000HB, S1000-2MB, Advance, Sony, Dongyi, VentecTaiflex, Shengyi, Huashuo, S1000HB, S1000-2MB, Advance, Sony, Dongyi, Ventec
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Min. Hole Size0.1mm0.1mm
Max. Hole Size6.4mm6.4mm
Hole Size Tolerance±0.05mm±0.05mm
Max. Aspect Ratio12:112:1
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
1/3oz Or 1/4oz Capable + UL Certified12um12um
Max. Base Copper Capable + UL Certified70um70um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Profile Tolerance±0.075mm±0.075mm
Routed Method (Laser, Punch)CNC, Punch, Laser, Precision DieCNC, Punch, Laser, Precision Die
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
0.5oz Base Copper for Double Sides & Multilayer | UL Certified | Line Width/Spacing0.05/0.05mm0.04/0.04mm
0.5oz Base Copper for Single Side | UL Certified0.05/0.05mm0.05/0.05mm
1.0oz Base Copper for Double Sides & Multilayer | UL Certified0.076/0.076mm0.076/0.076mm
1.0oz Base Copper for Single Side | UL Certified0.076/0.076mm0.076/0.076mm
1/3oz, 1/4oz Base Copper | UL Certified0.043mm/0.043mm0.043mm/0.043mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Min. Thickness | Coverlay12.5um12.5um
Max. Thickness75um85um
Min. Open Window0.1mm0.1mm
Cover Layer Type0515/0520/0525/1025/1035/10500515/0520/0525/1025/1035/1050
The Tolerance for Coverlay Registration±12.7um±2.54um
The Registration for Coverlay±0.05mm±0.05mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Etch Tolerance±10%±10%
The Pattern Accuracy0.0275mm0.0275mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Colour | Soldermask | UL CertifiedBlack, Blue, Yellow, Green, WhiteBlack, Blue, Yellow, Green, White
The Registration for Soldermask±0.05mm±0.05mm
Min. Thickness5um5um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
OSP Thickness | Surface Finish0.1-0.5um0.1-0.5um
Gold Plate | IPC StandardYesYes | Au:0.05-1.25um
ENIG | IPC StandardYesYes | Au:0.05-0.175um
Immersion Tin | IPC StandardYesYes | 1-40um
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Impedance Tolerance±10%±10%
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Material (PI, FR4, Others)PI, FR4, SUS, PETPI, FR4, SUS, PET, ALU
Registration Tolerance±0.1mm±0.1mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Shielding Film Type | Protect FilmYesYes | Fangbang HSF+SF5900
Ag Pastes TypeYesYes | JG-2680J

FLEX-RIGID CAPABILITY

Flex-Rigid printed circuit boards are boards that uses a combination of rigid and flexible boards technologies in your applications. Incorporating our advanced technology and reliability, the PCB Connect Group Flex Rigid capability gives you the security that your product deserves. Using our collaborative design for cost and design for manufacture programs, we can optimize your Flex Rigid design to help achieve your product aims.

CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
The Max.36L36L
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Max. PCB Size500x610mm500x800mm
Min. PCB Size2.5x2.5mm2.5x2.5mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Max. Board Thickness6.0mm6.0mm
Min. Board Thickness | UL Certified0.1mm0.1mm
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
Most Core66
CAPABILITY ELEMENT STANDARD CAPABILITY ADVANCED CAPABILITY
SymmetryYesYes
Non-SymmetryYesYes
Tail FlyYesYes
Air GapYesYes
OthersYesYes