CAPABILITY

Defining the PCB Connect Group PCB Capabilities

The information contained within our technology capabilities plan outlines the technologies that the PCB Connect Group offers as a standard today, and our development activity for the future. This is not an exhaustive list of our technology & product types but is provided as an overview to demonstrate the type of product we are manufacturing and the working tolerances we achieve.
Our capabilities are divided into two categories, “working” capabilities, which show the current extent of our capability & “developmental” which shows the next phase of our technology development across our business.
For further information about the PCB Connect Group’s PCB capabilities then contact one of our technical experts in your local PCB Connect Business.

Short Form Capability as of August 2020

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Layer Count Production & QTA1-40L Production & Quick Turnaround>60 Layer
Maximum Board Size (mm)1100 x 6101400 x 610
Board thickness range (mm)0.15 to 10mm0.15 to 14mm
Board thickness toleranceT<1.0 mm:±0.08mm; 1.0≤T<1.6mm:±0.13mm; 1.6≤T<2.0mm:±0.15mm; 2.0≤T<2.4mm:±0.20mm; 2.4≤T<3.0mm:±0.25mm; 3.0≤T<3.5mm:±0.28mm; 3.5≤T<4.0mm:±0.30mm; T≥4.0mm: ±10%T<1.0 mm: ±0.08mm; 1.0≤T<1.6mm:±0.13mm; 1.6≤T<2.0mm:±0.15mm; 2.0≤T<2.4mm:±0.20mm; 2.4≤T<3.0mm:±0.25mm; 3.0≤T<3.5mm:±0.28mm; 3.5≤T<4.0mm:±0.30mm; T≥4.0mm: ±10%

Materials Selection

(For full list of PCB Materials available please contact your local PCB Connect Group Business)

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Standard Rigid MaterialShengyi, Elite, Kingboard, NanYa, TUC, Grace, Ventec, Isola, Taconic, Rogers, Panasonic, Nelco, ITEQShengyi, Elite, Kingboard, NanYa, TUC, Grace, Ventec, Isola, Taconic, Rogers, Panasonic, Nelco, ITEQ
Low Loss Material CapabilityMegtron-4 + 4S, S7038,S7439, S7439C,TU872SLK, FR408HR, EM-828, EM888, N4000-13 + N4800-20 range of materials, IT968Megtron-4 + 4S, S7038,S7439, S7439C,TU872SLK, FR408HR, EM-828, EM888, N4000-13 + N4800-20 range of materials, IT968
Metal Base PartnersBerquist, Kinwong, Ventec, Doosan, Denka, ArlonBerquist, Kinwong, Ventec, Doosan, Denka, Arlon
Ceramic Material PartnersRogers, Arlon, Shengyi, TaconicRogers, Arlon, Shengyi, Taconic
PTFE PartnersPanasonic, Arlon, RogersPanasonic, Arlon, Rogers

Copper Weight Inner Layer

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Maximum Copper Weight Inner Layer12 oz15 oz

Copper Weight Outer Layer

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Maximum Copper Weight Outer Layer12 oz15 oz

Inner Layer Capability

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Min Line width/Spacing(0.5oz)0.0762 mm0.0762 mm
Min Line width/Spacing(1.0oz)0.0762 mm0.0762 mm
Min Line width/Spacing(2.0oz)0.1524 mm0.1524 mm
Min Line width/Spacing(3.0oz)0.1778 mm0.1778 mm
The Min distance hole to copper0.15mm min0.15mm min
The Min Regisition for laminate~+/-0.10mm~+/-0.10mm

Outer Layer Capability

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Min Line width/Spacing (0.5 oz)0.0762 mm2/2 mil

Controlled Impedance

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Controlled Impedance +/- %+/-7%+/- 5%

Drilling Capability

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Drill bit Range0.15mm-6.8mm0.15mm-6.8mm
Minimum Mechanically Drilled Hole0.15mm0.10mm
Slot tolerance~+/-0.0762 mm~+/-0.0762 mm
Minimum Slot Width0.4mm0.4mm
Minimum Distance Between Via Wall0.15mm0.15mm
Hole wall roughness<25um<25um
The min depth for control routed0.15mm0.15mm
The depth tolerance for controlled routing~+/-0.0762 mm~+/-0.0762 mm
The Max depth for backdrill6.0mm6.0mm
The min backdrill hole0.15mm0.15mm
Backdrill depth tolerance~+/-0.1016 mm~+/-0.1016 mm
Backdrill accuracy~+/-0.0508 mm~+/-0.0508 mm
Aspect Ratio PTH20:0122:01
Aspect Ratio Blind Via Hole0.8:11.4:1
Finished Hole Tolerance PTH~+/-0.05 mm~+/-0.05 mm
Finished Hole Tolerance NPTH~+/-0.025 mm~+/-0.025 mm
Copper plated tolerance<5um<5um

Soldermask

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Color for soldermaskGreen, Blue, Red, Yellow, Black, White
Soldermask Brands AvailableTaiyo, Peters, Rongda, LianzhiTaiyo, Peters, Rongda, Lianzhi
Soldermask thicknessAt trace shoulder:>10 (0.01016 mm) On copper surface:>15 (0.01498 mm)At trace shoulder:>10 (0.01016 mm) On copper surface:>15 (0.01498 mm)
Coverage for soldermask plug60%60%
Coverage for resin fill plug100%100%
Minimum Solder Mask Dam0.10mm0.05mm
Minimum Solder Mask Clearance0.075mm0.025mm

Silkscreen

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Available Silkscreen ColourWhite, Yellow, BlackWhite, Yellow, Black

Surface Finish

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Available Surface FinishesENIG, Immersion Tin,HASL,Pb free HASL,OSP, Plated heavy Au,Immersion Ag, ENEPIG, ASIG, Selective Hard and Soft GoldENIG, Immersion Tin,HASL,Pb free HASL,OSP, Plated heavy Au,Immersion Ag, ENEPIG, ASIG, Selective Hard and Soft Gold

Gold Finger

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Au thickness0.025-1.51um0.025-1.51um
Ni thickness2-12 um2-12 um
Chamfer angle15°~60°15°~60° On copper surface:>15 (0.01498 mm)
Chamfer lengthNo limitNo limit
Chamfer length tolerance~+/-0.1 mm~+/-0.1 mm

Routing Process

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Profile tolerance~+/-0.0762 mm~+/-3mil
The min Routed tooling0.8mm0.8mm

V-CUT

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Jump V-scoreYY
The min distance for jump V-score5.0mm5.0mm
The max work panel580*900mm580*900mm On copper surface:>15 (0.01498 mm)
The max board thickness4.00mm4.00mm
The tolerance for v-score remain thickness±0.10mm±0.10mm
Angle30°, 45°, 60°30°, 45°, 60°
The accuracy for the v-score both sides~+/-0.1mm~+/-0.1mm

Buried Capacitance

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Capacitance material (3M c-ply)3M C-PLY3M C-PLY
Single Etch or Double EtchDouble sided etchDouble sided etch
Maximum Available Layercount14L16L

Peelable Soldermask

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
AvailableAvailable

Carbon Print

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
AvailableAvailable

Heavy Cooper (over 5.0oz inner layer)

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Over 5.0oz inner layerAvailableAvailable
The max layers20L20L

Epoxy via Plugging to IPC4761 Type VI

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
AvailableMin via size: 0.3mm, Aspect Ratio: 10:1Min via size: 0.3mm, Aspect Ratio: 10:1

Control depth Drill

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Accuracy~+/-0.1mm~+/-0.1mm
Aspect Ratio1:011:01

HDI Constructions

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
1+N+1AvailableAvailable
2+N+2AvailableAvailable
3+N+3AvailableAvailable
4+N+4AvailableAvailable
Any Layer Interconnect (ALIC)AvailableAvailable

Material

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
HDI Normal CoreITQ, Shengyi, EMCITQ, Shengyi, EMC
HDI Normal Prepreg106/2113106/2113

Board Thickness

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
The max board thickness10mm10mm
The min board thickness0.3mm0.3mm

Layers

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
The max32L32L

Inner Layer

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Min Line width/Spacing0.0762 mm0.0762 mm
The min distance hole to copper0.15mm0.15mm

Laser Drill

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
The min Laser vias0.075mm0.075mm
Aspect Ratio1:011:01

Fill vias by Plating

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Filled vias by PlatingAvailableAvailable

Laminate

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Copper foil (1/4oz, 1/3oz, 3/8oz)AvailableAvailable
Registration~+/-0.1mm~+/-0.1mm

Laser Drill Method

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
LDDYesYes
Large WindowBigger than hole size for 0.075mm (Single Side)Bigger than hole size for 0.075mm (Single Side)
Same WindowOkOk

Outer Layer

Capability ElementWorking Capability 2020Developmental Capability (2020-2021 Horizon)
Min Line Width/Spacing0.0762mm0.0762mm
The Min distance hole to copper0.15mm0.15mm
Technology ElementPCB Connect Group Capability Overview
Available Layer CountSingle & Double Sided up to 6L Multilayer
EMI Shielding AvailableSilver Paste Covered with Yellow Ink
Minimum Line Widht and Space25um/25um Single Sided and 40um/40um 2L
Finished Copper Weight18um to 70um
Maximum Delived Panel Dimensions600mm x 450mm
Available Surface FinishesENIG, Electrolytic Gold Plating, OSP
Smallest Laser Drilled Hole Size0.10mm to 0.057mm advanced
Finished Board Thickness0.05mm to 0.8mm
Solder Mask and Resin Plugged ViasSolder Mask and Resin Plugged vias to IPC4761 type VI
Material Systems AvailablePolyester, Polyimide, PET, PEN
Outline ProfileLaser, Punch, Rout
Technology ElementPCB Connect Group Capability Overview
Available Layer Count4-20 Layer
Copper Weight Finished18um to 70um
Laminate Systems AvailableRA Copper, HTE Copper, FR-4, Polyimide, Adhesive
Minimum Line Width & Space2.5mil Minimum Line Width and Space
PCB Thickness0.3mm to 3.5mm
Available Surface FinishesENIG, Immersion Tin, HASL, PB Free Hasl, OSP, Heavy Plated Au, Immersion AG, ENEPIG, ASIG, Selective Hard and Soft Gold, Rhodium
Smallest Mechanically Laser Drilled Hole Size0.10 to 0.07mm advanced

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